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SWF200 焊丝送丝机

适用于激光焊接工艺的高精度焊丝送丝系统

SWF200 焊丝送丝单元专为在激光焊接过程中精确、可控地输送直径为0.5 毫米至 1.2 毫米的焊丝而设计。

  • 适用于激光焊接工艺的精密焊丝送丝系统
  • 适用于直径为0.5 mm 至 1.2 mm的焊丝
  • 通过LPC04 LASCON® 工艺控制器实现全自动控制
  • 可调节的进给速度
  • 可调节的进给加速度
  • 50 µm的送丝分辨率
  • 由处理器控制的高精度焊丝送丝
  • 两个无齿轮步进电机
  • 自动线轴末端检测
  • 线轴更换简便
  • 提供两种型号:可调节导丝或直线导丝

信息

SWF200是一款用于自动化激光焊接工艺的高精度焊丝送丝装置。它专为以可控且可重复的方式输送直径为0.5 毫米至 1.2 毫米的焊丝而设计。

该装置通过LPC04 LASCON® 工艺控制器实现全自动控制。因此,可精确根据工艺需求调整所需的焊料用量。进给速度和进给加速度均可调节,并可通过 LASCON® 脚本语言进行参数设置。

SWF200 特别适合作为现有梅根塔勒(Mergenthaler)系统的配件,可与LPC04 LASCON® 工艺控制器LH103 激光头LH501M 激光头配合使用。

Adjustable wire guide

The version with an adjustable wire guide offers a high degree of flexibility and is particularly suitable for laboratory applications, tests and experimental set-ups.

Straight wire guide

The version with a straight wire guide is designed for harsh environmental conditions, heavy-duty production processes and high-volume production.

  • Product: SWF200
  • Description: Solder Wire Feeder
  • Application: for use only in conjunction with the Mergenthaler LASCON® Process Controller
  • Wire diameter: 0.5 mm to 1.2 mm
  • Wire feed resolution: 50 µm
  • Feed speed: adjustable
  • Feed acceleration: adjustable
  • Process control: via LPC04 LASCON® Controller
  • Parameterisation: via the LASCON® scripting language
  • Drive: two gearless stepper motors
  • Reel monitoring: automatic end-of-reel detection
  • Ambient temperature: max. 55°C
  • Weight: approx. 500 g, drive unit only, excluding mounting kit and wire guide
  • CE marking: in accordance with EU directives on electromagnetic compatibility
  • Compliance: Complies with the RoHS Directive 2011/65/EU

订单号商品重量约
50-003806SWF200,焊丝送丝机500 克
50-003826直线导线130 克
50-000379LH501-M 安装套件及可调节导线架500 克

  • Laser brazing
  • Automated brazing wire feeding
  • Precise control of the amount of solder used in the process
  • For use with the LPC04 LASCON® Process Controller
  • For use with the LH103 laser head
  • For use with the LH501M laser head
  • Production processes using solder wire from 0.5 mm
  • Laboratory set-ups and experimental configurations