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LH501

Robust laser head up to 500W continuous wave

The LH501 is a flexible laser processing head for diode or fibre lasers. It features a coaxial, fibre-coupled infrared pyrometer or quotient pyrometer and a process camera. Various spot geometries can be set.

  • For diode lasers or fibre lasers with QBH, LLK-A, D80, FSMA905 or fibre laser collimation optics
  • Available for wavelengths from 808 nm to 1100 nm
  • Suitable for laser processes using two different laser wavelengths simultaneously
  • 1" optics
  • Ring light and cross-jet optional

Information

 

The LH501 laser head is suitable as a universal processing head for laser brazing, plastic welding and other applications involving diode lasers with an optical power output in the range of 100W to 500W.

The LH501 laser head is optionally fitted with a fibre-coupled pyrometer and a video camera. The pyrometer and video camera are coaxially aligned within the laser beam path via beam splitters. The video camera is clamped in place and can still be focused even when processing material outside the focal plane.

If required, the LH501 can be temperature-controlled using air or water via a cooling flange. In addition, a process gas can be supplied via a separate connection.

A brazing wire feeder can be fitted to the laser head. This results in a compact system for wire-fed laser brazing.

Laser fibre optic cables with FSMA905, D80, QBH and LLK-A connectors can be connected. IPG diode lasers with a fixed collimator (pigtailed) can also be connected to the process head.

  • Maximum laser power 500W
  • Fibre-optic connection: FSMA905, D80, LLK-A or IPG fixed collimator
  • Optionally available with pyrometer and video camera
  • Pyrometer and camera coaxial with the laser beam
  • USB camera with SXGA resolution
  • Camera can be focused for work outside the focal plane
  • Ring light with adjustable brightness
  • Typical working distances: 50 mm, 100 mm, 150 mm, 200 mm, 250 mm, 300 mm
  • Weight: 1.2 kg

Applications for the LH501 laser processing head include laser brazing, laser plastic welding, laser heating of components in a vacuum in the semiconductor industry, and applications in research and development.